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Meeting the Requirements of SMT Automated Pick-and-Place Production
With the rapid development of new energy vehicles and intelligent driving, the number of precision components such as automotive-grade chips, connectors, and various sensors continues to grow, imposing stringent automotive-grade requirements on packaging in terms of electrostatic discharge (ESD) protection, dimensional accuracy, and vibration resistance.
Luo Sheng Di's carrier tapes, cover tapes, and plastic reels are designed for the packaging of automotive control chips, signal sensors, in-vehicle connectors, power devices, and other components, and are fully compatible with SMT automated pick-and-place production. Our products feature strict ESD control and stable cavity dimensional accuracy, effectively preventing issues such as pin damage, electrostatic damage, and component displacement during long-distance transportation and warehousing.
Given the wide variety of automotive electronic parts and the prevalence of irregularly shaped components, the company supports non-standard customized development. We can design carrier tape cavities based on component geometry and tolerance requirements, serving the supply chains for various components including automotive control systems, body electrical systems, and ADAS driver-assistance systems. From component manufacturers to automotive electronics manufacturers, we provide stable and reliable packaging solutions that help improve the production yield of automotive electronic products.
